We have published GOS No. 541, Cross-Section Measurement of Flexible Printed Circuit Cable (5×).
This report demonstrates a non-destructive method for analyzing the internal structure of a flexible printed circuit (FPC) cable using white-light interferometric cross-sectional imaging. The interfaces between the FPC surface, transparent insulating layer, and embedded conductors are clearly visualized.
By automatically detecting the extracted interface profiles, the system measures and displays the thickness of the insulating layer covering the conductors. This capability enables quantitative evaluation of multilayer electronic structures without destructive sample preparation.
The report presents cross-sectional images, extracted interface profiles, and automatically generated thickness profiles, illustrating the effectiveness of cross-sectional analysis for thickness measurement of transparent polymer layers in electronic components.
